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​吳添立教授

​電子所副教授

國際半導體學院/產創學院/半導體系合聘教授

聯發科技青年講座教授

英國高等教育學院院士

​​Ph.D. in EE, imec / KU Leuven

Office: ED536
Phone: 03-5712121#59442
​tlwu@nycu.edu.tw

PROFESSIONAL EXPERIENCE

2024.08 – present 國立陽明交通大學電子研究所副教授

2024.08 – present 國立陽明交通大學電機工程學系副教授

2024.07 – present IEEE EDS Technical Committees on Electronic Materials
2023.08 – present Editor, Scientific Reports (Nature Journal)

2023.01 – present IEEE EDS Technical Committees on Compound Semiconductor Devices & Circuits

2023.01 – present IEEE EDS Technical Committees on Compact Modeling

2023.01 – present 工業技術研究院電光系統所特聘研究員

2022.08 – present 國立陽明交通大學奈米科學及工程學士班合聘教授

2022.02 – present 國立陽明交通大學產業創新研究學院合聘教授

2021.10 – present 科技部”次世代化合物半導體前瞻研發專案計畫”專案執行長

2021.11 – present 台灣靜電放電防護工程學會理事

2021.08 – present 國立陽明交通大學國際半導體產業學院副教授

2019.09 – present 交大國際高等教育認證中心種子教師

2017.08 – present 聯發科技青年講座教授

2022.08 – 2023.02 國立陽明交通大學國際半導體產業學院副院長

2021.02 – 2021.07 國立陽明交通大學國際半導體產業學院助理教授

2017.02 – 2021.01 國立交通大學國際半導體產業學院助理教授

2016.08 – 2017.01 比利時微電子研究中心imec 研究科學家

2011.09 – 2016.07 比利時微電子研究中心imec 博士研究員

2016.01 – 2016.03 美國IBM訪問學者

2014.01 – 2016.08 駐歐盟兼駐比利時代表處科技部國合科技簡訊網編輯

2012.08 – 2014.07​ 比利時魯汶大學台灣學生會會長及監事

AWARDS and HONORS

2023 中國電機工程學會優秀青年電機工程師獎

2023 國科會吳大猷先生紀念獎

2023 國科會優秀年輕學者研究計畫

2023 國立中興大學電機工程學系傑出系友

2022 台灣電子材料與元件協會傑出青年獎

2022 陽明交大110學年度優良教學獎

2021 台灣半導體產業協會『2021 TSIA半導體獎』

2020 Outstanding Master Thesis Award, Taiwan Inst. of Electrical and Electronic Eng. (TIEEE)

2020 交通大學績優導師

2020 Fellow of the Higher Education Academy (FHEA), Advanced HE

2019 教育部優秀外國青年來臺蹲點計畫(TEEP)績優案例

2019 108年科技部年輕學者養成計畫-愛因斯坦培植計畫

2017 聯發科技青年講座教授

2015 Fellowship for long stay abroad research, Flanders Research Foundation (FWO)

2012 Imec Ph.D. Fellowship

2011 Imec Predoctoral scholarship

2006 ENE admission scholarship, National Tsing Hua University (NTHU)

IEEE Electron Device Letters Golden Reviewer 2014, 2015, 2016, 2019

IEEE Transactions on Electron Device Golden Reviewer 2016, 2017, 2018

​PROFESSIONAL SERVICE

Technical program committee:

  • IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (2019-2022)

  • European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF) (2019-2022)

  • Electron Devices Technology and Manufacturing (EDTM) Conference (2019, 2020) 

  • Taiwan ESD and Reliability Conference (TESDC) (2017-2022)

EDUCATION

Ph.D., Electrical Engineering, KU Leuven, Belgium (2016)

Business Strategy & Consulting, Imperial College London, UK (2014)

M.S., Electronics Engineering, National Tsing Hua University, Taiwan (2008)

B.S., Electrical Engineering, National Chung Hsing University, Taiwan (2006)

Prof. Tian-Li Wu (HEA Fellow) received the Ph.D. degree in electrical engineering from KU Leuven, Belgium, in 2016. From 2011 to 2017, He was with the GaN power device group at imec, Leuven, Belgium, where he focused on research and development of CMOS compatible 200-mm GaN-on-Si platform for power switching applications and investigation of reliability issues in GaN power devices. In 2016, he visited IBM, New York, NY, USA, where he focused on interface characterization in sub-10nm SiGe pMOS FinFETs. He is currently the Associate Professor with Institute of Electronics (IEE) and Department of Electronics and Electrical Engineering (DEE) and the Joint Professor with International College of Semiconductor Technology (ICST) and Industry Academia Innovation School (IAIS) at National Yang Ming Chiao Tung University, Hsinchu, Taiwan, and was named the MediaTek Junior Chair Professor in 2017.

 

He was the recipient of the Semiconductor Award from the TSIA in 2021, Fellow of the Higher Education Academy (HEA Fellow) in 2020, MOST Young Scholar Fellowship in 2019, MediaTek Junior Chair Professorship in 2017, the Fellowship for long term abroad research from FWO (Flanders Research Foundation) in 2015, and imec Ph.D. Fellowship in 2012. 

He authored and coauthored more than 100 publications in peer reviewed journals or conferences. His research interests focus on 1) GaN and SiC Power semiconductor and electronics, 2) Advanced sub-5nm logic devices, and 3) reliability evaluation and degradation analysis, and 4) AI-assisted device design and reliability predictions.

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